By Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
ISBN-10: 0387765328
ISBN-13: 9780387765327
ISBN-10: 1441945628
ISBN-13: 9781441945624
This ebook specializes in foundry-based technique know-how that allows the fabrication of 3D ICs. The center of the booklet discusses the know-how platform for pre-packaging wafer lever three-D ICs. notwithstanding, this publication doesn't comprise a close dialogue of 3-D ICs layout and three-D packaging. this is often an edited publication according to chapters contributed by way of a number of specialists within the box of wafer-level three-D ICs technique expertise. they're from academia, study labs and industry.
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) by Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
by Edward
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